Patent Assignment
Reel/Frame 040701/0061
Assignment of Assignor's Interest
Recorded: 2016-12-09
Pages: 4
Assignor
CHO, YUN-RAE
Executed: 2016-10-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices with Multi-Component Solder Bumps
Application:
15/374,392 →
Publication:
US 2017/0221866