Patent Assignment
Reel/Frame 040755/0774
Assignment of Assignor's Interest
Recorded: 2016-12-22
Pages: 5
Assignors
WU, CHIA-TIEN
Executed: 2016-12-16
LIU, HSIANG-WEI
Executed: 2016-12-16
YANG, TAI-I
Executed: 2016-12-12
CHU, WEI-CHEN
Executed: 2016-12-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
2-D Interconnections for Integrated Circuits