Patent Assignment
Reel/Frame 040759/0705
Assignment of Assignor's Interest
Recorded: 2016-12-23
Pages: 3
Assignor
MORAN, SEAN
Executed: 2016-12-05
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Wafer-Level Flipped Die Stacks with Leadframes or Metal Foil Interconnects
Patent:
9,490,195 →
Application:
14/883,864 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 22, 2015
From: PRABHU, ASHOK S.; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 036860/0316 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0758 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0807 →