Patent Assignment
Reel/Frame 040761/0898
Assignment of Assignor's Interest
Recorded: 2016-12-23
Pages: 3
Assignee
NEPES CO., LTD.
105, GEUMIL-RO 965BEON-GIL, SAMSEONG-MYEON, EUMSEONG-GUN, CHUNGCHEONGBUK-DO, 369-832, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing the Same