Patent Assignment
Reel/Frame 040791/0106
Assignment of Assignor's Interest
Recorded: 2016-12-28
Pages: 4
Assignors
LONG, SHUN-WEN
Executed: 2016-12-26
CHIOU, GUO-JYUN
Executed: 2016-12-26
KUO, MENG-HAN
Executed: 2016-12-26
HUANG, MING-CHIEH
Executed: 2016-12-26
LIN, HSI-CHIEN
Executed: 2016-12-26
CHEN, CHIN-KANG
Executed: 2016-12-26
CHEN, YI-PIN
Executed: 2016-12-26
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., ZHONGLI DIST., TAOYUAN CITY, 320, TAIWAN
Covered Property
(1)
Chip Package and Manufacturing Method Thereof