Patent Assignment
Reel/Frame 040823/0356
Assignment of Assignor's Interest
Recorded: 2017-01-03
Pages: 4
Assignors
LIN, JIAN-HONG
Executed: 2016-12-20
LIU, KUO-YEN
Executed: 2016-12-21
CHANG, HSIN-CHUN
Executed: 2016-12-23
LEE, TZU-LI
Executed: 2016-12-23
LEE, YU-CHING
Executed: 2016-12-20
WANG, YIH-CHING
Executed: 2016-12-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device Including Dummy via Anchored to Dummy Metal Layer