Patent Assignment
Reel/Frame 040827/0578
Assignment of Assignor's Interest
Recorded: 2017-01-03
Pages: 3
Assignors
WANG, ZHIQI
Executed: 2016-12-13
YU, QIONG
Executed: 2016-12-12
WANG, WEI
Executed: 2016-12-12
Assignee
CHINA WAFER LEVEL CSP CO., LTD.
NO.29 TINGLAN LANE SIP, SUZHOU, JIANGSU, 215026, CHINA
Covered Property
(1)
Fingerprint Recognition Chip Packaging Structure and Packaging Method