Patent Assignment
Reel/Frame 040847/0412
Assignment of Assignor's Interest
Recorded: 2017-01-05
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package with Dummy Bumps Connected to Non-Solder Mask Defined Pads