Patent Assignment
Reel/Frame 040854/0349
Assignment of Assignor's Interest
Recorded: 2016-12-08
Pages: 12
Assignors
WANG, MINGZHU
Executed: 2016-11-16
ZHAO, BOJIE
Executed: 2016-11-21
CHEN, ZHENYU
Executed: 2016-11-16
TANAKA, TAKEHIKO
Executed: 2016-11-13
GUO, NAN
Executed: 2016-11-16
HUANG, ZHEN
Executed: 2016-11-16
CHENG, DUANLIANG
Executed: 2016-11-16
DING, LIANG
Executed: 2016-11-16
CHEN, FEIFAN
Executed: 2016-11-16
JIANG, HENG
Executed: 2016-11-17
Assignee
NINGBO SUNNY OPOTECH CO., LTD.
66-68, SHUNYU ROAD, YUYAO,, NINGBO, ZHEJIANG, 315400, CHINA
Covered Property
(1)
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device