Patent Assignment
Reel/Frame 040870/0436
Assignment of Assignor's Interest
Recorded: 2017-01-06
Pages: 2
Assignors
CHENG, ANHAO
Executed: 2017-01-04
LIU, CHUN-CHANG
Executed: 2017-01-04
YEH, SHENG-WEI
Executed: 2017-01-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Redistribution Layer Structure and Fabrication Method Therefor