Patent Assignment
Reel/Frame 040876/0178
Assignment of Assignor's Interest
Recorded: 2017-01-06
Pages: 6
Assignors
ZHANG, KEEN
Executed: 2016-12-15
FENG, JI
Executed: 2016-12-15
KONG, DE-JIN
Executed: 2016-12-15
LI, YUN-FEI
Executed: 2016-12-15
ZHANG, GUO-HAI
Executed: 2016-12-15
TEY, CHING-HWA
Executed: 2016-12-20
FENG, JING
Executed: 2016-12-27
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Interconnect Structure and Fabricating Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.