IP Library › Assignment 040885/0297
Patent Assignment
Reel/Frame 040885/0297

Change of Name

Recorded: 2016-12-12 Pages: 5
Assignor
Assignee
PANASONIC CORPORATION
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Properties (5)
Component Built-in Module and Method of Manufacturing the Same
Patent: 6,489,685 →
Application: 10/038,212 →
Publication: US 2002/0135058
Component Built-in Module and Method of Manufacturing the Same
Patent: 6,955,948 →
Application: 10/271,937 →
Publication: US 2003/0062624
Component Built-in Module and Method for Producing the Same
Patent: 6,975,516 →
Application: 10/272,599 →
Publication: US 2003/0090883
Module with Built-in Circuit Component and Method for Producing the Same
Patent: 7,248,482 →
Application: 10/844,823 →
Publication: US 2004/0226744
Component Built-in Module and Method for Producing the Same
Patent: 7,294,587 →
Application: 11/126,029 →
Publication: US 2005/0269681
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 15, 2017
From: PANASONIC CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 041581/0039 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →