Component built-in module and method for producing the same
View Patent ↗A component built-in module includes an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer. In this module, at least one of the wirings is formed on a surface of a wiring board, and the components embedded inside of the insulating layer are mounted on and integrated with the wiring board before embedding. This configuration allows the components such as a semiconductor to undergo a mounting inspection and a property inspection before embedding. As a result, the yields of the module can be improved. In addition, since the components are integrated with the wiring board and embedded, the strength thereof can be enhanced.
1. A method of producing a component built-in module including an insulating layer, wirings integrated with both surfaces of the insulating layer, a via connecting the wirings, and one or more components selected from an electronic component and a semiconductor, which is embedded inside of the insulating layer, wherein at least one of the wirings is formed on a surface of a wiring board, comprising the steps of:
mounting the one or more components selected from an electronic component and a semiconductor on the wiring board;
forming the via along a thickness direction of the insulating layer, where the insulating layer is made of a thermosetting resin in a semi-cured state;
embedding the components in the insulating layer so that the wiring board is arranged outside; and
curing the insulating layer.
2. The method of producing a component built-in module according to claim 1 , wherein the components have undergone at least one inspection selected from a mounting inspection and a property inspection before the step of embedding the components in the insulating layer.
3. The method of producing a component built-in module according to claim 1 , wherein the wiring board is integrated on either surface of the insulating layer.
4. The method of producing a component built-in module according to claim 1 , wherein the components are mounted on both surfaces of the at least one wiring board.
5. The method of producing a component built-in module according to claim 1 , wherein the semiconductor is ground or polished when the semiconductor is in a semiconductor wafer state before mounting.
6. The method of producing a component built-in module according to claim 1 , wherein the semiconductor is ground or polished after mounting the semiconductor.
7. The method of producing a component built-in module according to claim 1 , wherein concurrently with the step of embedding one or more components selected from a semiconductor and a electronic component in the insulating layer, the insulating layer is cured.
8. The method of producing a component built-in module according to claim 1 , wherein a shielding layer is formed in the insulating layer after the step of forming the via and before the step of embedding the components.
9. The method of producing a component built-in module according to claim 8 , wherein the shielding layer is formed by forming a wiring pattern of copper foil.
10. The method of producing a component built-in module according to claim 8 , wherein the shielding layer is formed by laminating electromagnetic shielding layers.