Patent Assignment
Reel/Frame 040946/0656
Assignment of Assignor's Interest
Recorded: 2017-01-11
Pages: 3
Assignor
WAGNER, THOMAS
Executed: 2017-01-11
Assignee
INTEL IP CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multi-Layer Redistribution Layer for Wafer-Level Packaging
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.