Patent Assignment
Reel/Frame 040974/0311
Assignment of Assignor's Interest
Recorded: 2017-01-13
Pages: 3
Assignor
WU, WENG-JIN
Executed: 2017-01-13
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Molded Image Sensor Chip Scale Packages and Related Methods
Patent:
9,960,197 →
Application:
15/405,519 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
Release of Security Interest in Patents Recorded at Reel 04481, Frame 0541
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →