Assignment of Assignor's Interest

Recorded: 2017-01-13 Pages: 4

Assignors

YOON, IN SANG

Executed: 2017-01-08

YANG, DEOKKYUNG

Executed: 2017-01-13

SONG, SUNGMIN

Executed: 2017-01-08

Assignee

STATS CHIPPAC PTE. LTD.

10 ANG MO KIO STREET 65, #04-08/09 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Integrated Circuit Packaging System with Molded Laser via Interposer and Method of Manufacture Thereof

Patent: 10,083,903 →

Application: 15/201,575 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.