Patent Assignment
Reel/Frame 040977/0469
Assignment of Assignor's Interest
Recorded: 2017-01-16
Pages: 3
Assignors
CHANG, CHE-CHENG
Executed: 2016-12-26
LIN, CHIH-HAN
Executed: 2016-12-26
TSENG, HORNG-HUEI
Executed: 2017-01-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Fin Structure and Method of Forming Same Through Two-Step Etching Processes