IP Library › Assignment 040979/0056
Patent Assignment
Reel/Frame 040979/0056

Assignment of Assignor's Interest

Recorded: 2017-01-17 Pages: 5
Assignors
ZHEN DING TECHNOLOGY CO., LTD.
Executed: 2017-01-01
Assignees
FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
XINYUAN INDUSTRIAL ZONE, TANGWEI VILLAGE,FUYONG TOWN, BAO' AN DISTRICT, SHENZHEN, CHINA
GARUDA TECHNOLOGY CO., LTD
4F., NO.156,SEC 1,ZHONGSHAN RD.,BANQIAO DIST.,,NEW TAIPEI CITY 22065,TAIWAN(R.O.C), NEW TAIPEI, TAIWAN
Covered Property (1)
Method of Manufacturing Multilayer Printed Circuit Board Having Buried Holes
Patent: 8,052,881 →
Application: 12/164,422 →
Publication: US 2009/0159559
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 11, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.
Reel/Frame 043312/0566 →
Change of Name Jul 30, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.
Reel/Frame 043378/0038 →