IP Library › Assignment 043378/0038
Patent Assignment
Reel/Frame 043378/0038

Change of Name

Recorded: 2017-07-30 Pages: 10
Assignor
Assignee
AVARY HOLDING (SHENZHEN) CO., LIMITED.
XINYUAN INDUSTRIAL ZONE, TANGWEI VILLAGE,FUYONG TOWN, BAO AN DISTRICT, SHENZHEN, CHINA
Covered Properties (64)
Retaining Apparatus for a Flexible Printed Circuit Board
Patent: 8,009,432 →
Application: 11/847,300 →
Publication: US 2008/0266819
Method for Manufacturing Multilayer Flexible Printed Circuit Board
Patent: 7,581,312 →
Application: 11/877,585 →
Publication: US 2008/0148562
Method for Manufacturing Multilayer Flexible Printed Circuit Board
Patent: 8,042,265 →
Application: 11/957,324 →
Publication: US 2008/0250637
Flexible Printed Circuit Board
Patent: 7,511,962 →
Application: 11/960,656 →
Publication: US 2008/0285241
Coverlay Processing System
Patent: 8,322,017 →
Application: 11/961,241 →
Publication: US 2008/0314719
Printed Circuit Board Assembly Having Adhesive Layer
Patent: 7,728,232 →
Application: 11/964,578 →
Publication: US 2009/0035566
Flexible Printed Circuit Board Holder
Patent: 7,903,424 →
Application: 11/967,000 →
Publication: US 2009/0001641
Printed Circuit Boards
Patent: 8,049,113 →
Application: 12/047,152 →
Publication: US 2008/0283289
Method of Cutting Pcbs
Patent: 7,943,490 →
Application: 12/051,687 →
Publication: US 2009/0042370
Apparatus for Holding Printed Circuit Boards
Patent: 7,916,499 →
Application: 12/055,587 →
Publication: US 2009/0045151
Flexible Printed Circuit Board Having Curved Edge
Patent: 8,071,884 →
Application: 12/106,513 →
Publication: US 2009/0014204
Visual Inspection Apparatus for Flexible Printed Circuit Boards
Patent: 7,872,744 →
Application: 12/110,540 →
Publication: US 2009/0033925
Method for Manufacturing a Printed Circuit Board
Patent: 8,205,330 →
Application: 12/135,873 →
Publication: US 2009/0159317
Method of Detecting Faulty via Holes in Printed Circuit Boards
Patent: 8,049,511 →
Application: 12/143,632 →
Publication: US 2009/0039895
Method of Manufacturing Multilayer Printed Circuit Board Having Buried Holes
Patent: 8,052,881 →
Application: 12/164,422 →
Publication: US 2009/0159559
Board Inverter
Patent: 8,061,959 →
Application: 12/202,551 →
Publication: US 2009/0175713
Printed Circuit Board and Method for Manufacturing Same
Patent: 8,071,887 →
Application: 12/253,869 →
Publication: US 2009/0242246
Method for Manufacturing Rigid-Flexible Printed Circuit Board
Patent: 7,789,989 →
Application: 12/270,612 →
Publication: US 2009/0183823
Method for Manufacturing Printed Circuit Board Having Different Thicknesses in Different Areas
Patent: 7,987,586 →
Application: 12/274,190 →
Publication: US 2009/0241333
Method for Manufacturing Multilayer Printed Circuit Boards
Patent: 8,112,880 →
Application: 12/342,205 →
Publication: US 2009/0229121
Method for Forming Electrical Traces on Substrate
Patent: 8,475,867 →
Application: 12/570,040 →
Publication: US 2010/0129532
Apparatus for Wet Processing Substrate
Patent: 8,388,800 →
Application: 12/766,903 →
Publication: US 2011/0024042
Flexible Printed Circuit Board Holder
Patent: 8,223,505 →
Application: 12/982,881 →
Publication: US 2011/0095464
Method for Manufacturing Printed Circuit Board with Cavity
Patent: 8,516,694 →
Application: 13/091,152 →
Publication: US 2011/0297644
Method for Manufacturing Printed Circuit Board
Patent: 8,978,244 →
Application: 13/116,001 →
Publication: US 2011/0302775
Electronic Component Device and Connector Assembly Having Same
Patent: 8,481,854 →
Application: 13/116,021 →
Publication: US 2011/0297437
Printed Circuit Board
Patent: 8,648,261 →
Application: 13/117,159 →
Publication: US 2012/0048603
Method for Manufacturing Multilayer Flexible Printed Circuit Board
Patent: 8,453,321 →
Application: 13/164,776 →
Publication: US 2011/0247207
Method for Manufacturing Multilayer Printed Circuit Board
Patent: 9,095,082 →
Application: 13/181,453 →
Publication: US 2012/0011713
Method for Manufacturing Multilayer Printed Circuit Board
Patent: 9,125,334 →
Application: 13/192,474 →
Publication: US 2012/0023744
Method for Manufacturing Rigid-Flexible Printed Circuit Board
Patent: 8,591,692 →
Application: 13/207,438 →
Publication: US 2012/0097326
Method for Manufacturing Rigid-Flexible Printed Circuit Board
Patent: 9,198,304 →
Application: 13/441,932 →
Publication: US 2012/0260501
Method for Manufacturing Printed Circuit Board
Patent: 9,107,311 →
Application: 13/858,102 →
Publication: US 2014/0054074
Method for Manufacturing Printed Circuit Board with Patterned Electrically Conductive Layer Therein Visible
Patent: 9,066,431 →
Application: 13/953,881 →
Publication: US 2014/0027164
Method for Manufacturing Printed Circuit Board
Patent: 9,066,417 →
Application: 13/974,382 →
Publication: US 2014/0053397
Method of Manufacturing a Printed Circuit Board with Circuit Visible
Patent: 9,288,914 →
Application: 14/082,196 →
Publication: US 2014/0144685
Compact Rigid-Flexible Printed Circuit Board and Method for Manufacturing Same
Patent: 9,210,811 →
Application: 14/095,878 →
Publication: US 2014/0305683
Rigid-Flex Printed Circuit Board and Method for Making Same
Patent: 9,072,173 →
Application: 14/140,456 →
Publication: US 2014/0182900
Flexible Printed Circuit Board and Method for Making Same
Patent: 9,357,631 →
Application: 14/162,769 →
Publication: US 2015/0034364
Printed Circuit Board and Method for Manufacturing Same
Patent: 9,820,388 →
Application: 14/458,236 →
Publication: US 2015/0040392
Flexible Printed Circuit Board and Method for Manufacturing Same
Patent: 9,277,640 →
Application: 14/586,986 →
Publication: US 2015/0189738
Heat Dissipation Device and Method for Manufacturing Same
Application: 14/691,258 →
Publication: US 2016/0061540
Thin Heat Dissipation Foil and Method for Manufacturing Same
Application: 14/835,978 →
Publication: US 2016/0320142
Method for Manufacturing Printed Circuit Board with Etching Process to Partially Remove Conductive Layer
Patent: 9,788,437 →
Application: 14/848,517 →
Publication: US 2016/0353582
Flexible Circuit Board and Method for Manufacturing Same
Patent: 9,615,445 →
Application: 14/858,652 →
Publication: US 2016/0381786
Flexible Circuit Board and Method for Manufacturing Same
Patent: 9,622,340 →
Application: 14/858,953 →
Publication: US 2017/0027054
Flexible Circuit Board and Method for Manufacturing Same
Patent: 9,485,859 →
Application: 14/859,857 →
Method for Making a Circuit Board
Patent: 9,872,393 →
Application: 14/886,581 →
Publication: US 2016/0366766
Circuit Board and Method for Making the Same
Application: 14/920,634 →
Publication: US 2017/0079136
Flexible Circuit Board and Method for Making the Same
Patent: 9,693,448 →
Application: 14/926,195 →
Publication: US 2017/0105280
Flexible Printed Circuit Board and Method for Manufacturing Same
Application: 14/927,888 →
Publication: US 2016/0150635
Method for Manufacturing Printed Circuit Board
Patent: 9,706,640 →
Application: 14/928,166 →
Publication: US 2016/0183357
Flexible Circuit Board and Method for Manufacturing Same
Application: 15/078,214 →
Publication: US 2017/0188451
Resin Composition and Adhesive Film and Circuit Board Made of the Same
Application: 15/191,516 →
Publication: US 2017/0275508
Ultrathin Heat Dissipation Structure
Application: 15/191,550 →
Publication: US 2017/0325356
Circuit Board and Method for Making the Same
Patent: 9,832,888 →
Application: 15/191,554 →
Publication: US 2017/0339795
Method for Making Conductive Polymer, and Composite Film and Circuit Board Having the Conductive Polymer
Patent: 9,807,868 →
Application: 15/273,730 →
Publication: US 2017/0339782
High Frequency Signal Transmission Structure and Method for Same
Application: 15/275,481 →
Publication: US 2017/0354030
Method for Making a Multilayer Flexible Printed Circuit Board
Patent: 9,807,877 →
Application: 15/285,593 →
Method for Manufacturing a Printed Circuit Board with High-Capacity Copper Circuit
Patent: 9,907,167 →
Application: 15/394,735 →
Composite Circuit Board and Method of Manufacturing the Same
Application: 15/581,947 →
Publication: US 2018/0192516
Printed Circuit Board
Patent: 9,992,858 →
Application: 15/604,798 →
Publication: US 2017/0265295
Method of Making a Flexible Printed Circuit Board
Application: 15/609,131 →
Publication: US 2018/0310412
Heat Dissipation Structure, Method for Making the Same, and Electronic Device Having the Same
Application: 15/615,065 →
Publication: US 2018/0082924
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 16, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0636 →
Assignment of Assignor's Interest Jan 16, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0367 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0934 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0939 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0944 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0957 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0970 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0975 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040979/0001 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040979/0015 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040979/0020 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040979/0046 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040979/0051 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040979/0056 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040979/0010 →
Assignment of Assignor's Interest Jan 17, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0691 →
Assignment of Assignor's Interest Jan 23, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; ZHEN DING TECHNOLOGY CO., LTD.
To: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 041036/0067 →
Change of Name Jul 10, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.
Reel/Frame 043312/0490 →
Change of Name Jul 11, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.
Reel/Frame 043340/0411 →
Change of Name Jul 11, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.; GARUDA TECHNOLOGY CO., LTD
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.; GARUDA TECHNOLOGY CO., LTD
Reel/Frame 043143/0077 →
Change of Name Jul 11, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.
Reel/Frame 043312/0499 →
Change of Name Jul 11, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.
Reel/Frame 043312/0508 →
Change of Name Jul 11, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.
Reel/Frame 043312/0517 →
Change of Name Jul 11, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.
Reel/Frame 043312/0528 →
Change of Name Jul 11, 2017
From: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD.
To: AVARY HOLDING (SHENZHEN) CO., LIMITED.
Reel/Frame 043312/0539 →