Method for manufacturing multilayer printed circuit boards
View Patent ↗A method for manufacturing a printed circuit board (PCB) includes: providing a first PCB substrate, a second PCB substrate and an adhesive layer, the first PCB substrate having a first main portion and a first unwanted portion divided by a first imaginary boundary, the second PCB substrate including a second main portion and a second unwanted portion divided by a second imaginary boundary; forming an opening in the adhesive layer; filling an filling mass in the opening; laminating the first PCB substrate, the second PCB substrate and the adhesive layer such that the adhesive layer is sandwiched between the first PCB substrate and the second PCB substrate, and the first, second imaginary boundaries are misaligned, a projection of each of the first and second imaginary boundaries in the adhesive layer being within the opening; and cutting the first and second PCB substrates along the first and second imaginary boundaries respectively.
1. A method for manufacturing a printed circuit board (PCB), comprising:
providing a first PCB substrate, a second PCB substrate and an adhesive layer, the adhesive layer having a first side and a second side opposite the first side, the first PCB substrate comprising a first main portion and a first unwanted portion, the first main portion and the first unwanted portion being divided by a first imaginary boundary, the second PCB substrate comprising a second main portion and a second unwanted portion, the second main portion and the second unwanted portion being divided by a second imaginary boundary;
defining an opening in the adhesive layer, the adhesive layer having a first inner edge and a second inner edge, the first and second inner edges being at opposite sides of the opening;
filling the opening using a filling mass, the filling mass having a first side and a second side opposite the first side;
laminating the first PCB substrate and the second PCB substrate directly on the adhesive layer in such a manner that a portion of the first imaginary boundary is aligned with the first inner edge, a portion of the second imaginary boundary is aligned with the second inner edge of the adhesive layer, the first PCB substrate is directly contacting the first sides of the adhesive layer and the filling mass, and the second PCB substrate is directly contacting the second sides of the adhesive layer and the filling mass; and
removing the first and second unwanted portions from the first and second PCB substrates along the first and second imaginary boundaries respectively.
2. The method for manufacturing a printed circuit board as claimed in claim 1 , wherein the filling mass is attached to the second PCB substrate prior to the step of filling the opening, and the filling mass is received in the opening when the first PCB substrate, the second PCB substrate, and the adhesive layer are laminated together.
3. The method for manufacturing a printed circuit board as claimed in claim 1 , wherein the filling mass is comprised of a material selected from the group consisting of rubber, silicone rubber, polycarbonate, and polypropylene.