Method for manufacturing multilayer flexible printed circuit board
View Patent ↗A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.
1. A method for manufacturing a multilayer flexible printed circuit board, the method comprising steps of:
providing a first substrate, a binder layer, and a second substrate, the first substrate and the second substrate each including at least one dielectric layer and at least one conductive layer formed on the at least one dielectric layer, the first substrate having a main portion and an excess portion, the at least one conductive layer of the first substrate including an outermost conductive layer located at a first side of the first substrate;
defining a first slit in the first substrate along a partition line between the main portion and the excess portion, the first slit extending inwardly from an opposite second side of the first substrate and terminating at the outermost conductive layer;
defining an opening in the binder layer;
laminating the first substrate and the second substrate on opposite surfaces of the binder layer in a manner such that a majority of the excess portion of the first substrate is exposed to and suspended above the opening of the binder layer thereby obtaining a semi-finished FPCB;
forming a conductive pattern in the outermost conductive layer;
defining a second slit in the outermost conductive layer along the partition line between the main portion and the excess portion; and
cutting the semi-finished FPCB along a peripheral boundary line of the excess portion so as to remove the excess portion of the first substrate, thus a portion of the second substrate being exposed to an exterior through the opening of the binder layer.
2. The method as claimed in claim 1 , further comprising a step of defining a locating hole in the first substrate, the binder layer and the second substrate.
3. The method as claimed in claim 1 , wherein the first slit is formed using at least one laser.
4. The method as claimed in claim 3 , wherein the at least one laser is a carbon oxide laser.
5. The method as claimed in claim 3 , wherein the first slit is formed using a first laser and a second laser alternatively.
6. The method as claimed in claim 1 , wherein the second slit is formed during forming the conductive pattern in the outermost conductive layer.
7. The method as claimed in claim 1 , wherein the second slit is formed after the conductive pattern is formed.
8. The method as claimed in claim 7 , wherein the second slit is formed using a laser.
9. The method as claimed in claim 8 , wherein the laser is a Nd:YAG laser.
10. The method as claimed in claim 1 , wherein the semi-finished FPCB is cut using a stamper or a laser.