Method of cutting PCBS

1. A method of cutting a printed circuit board (PCB) module, the PCB module having a laser cutting area and a plurality of through holes, the method comprising:

providing a coverlay film with at least one opening defined therein;

attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area thereof is exposed via the at least one opening;

holding the PCB module using a vacuum suction device and applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and

removing the coverlay film.

2. The method of cutting a PCB module as claimed in claim 1 , wherein the coverlay film is a transparent plastic film.

3. The method of cutting a PCB module as claimed in claim 2 , wherein the coverlay film is comprised of a material selected from the group consisting of polyethylene and polypropylene.

4. The method of cutting a PCB module as claimed in claim 1 , wherein the PCB module defines a plurality of first positioning holes, and the method further comprises a step of forming a plurality of corresponding second positioning holes in the coverlay film.

5. The method of cutting a PCB module as claimed in claim 4 , wherein the first positioning holes are exposed to the outside via the corresponding second positioning holes in the step of attaching the coverlay film onto the PCB module, and a mark-identifying device is used to obtain the position of the first positioning holes as a positioning reference in the step of applying a laser beam to the exposed laser cutting area of the PCB module.

6. The method of cutting a PCB module as claimed in claim 1 , wherein the PCB module defines a plurality of positioning marks, the coverlay film is transparent, and, when the laser beam is applied to the exposed laser cutting area of the PCB module to cut the PCB module, a mark-identifying device is used to obtain the position of the positioning marks as a positioning reference.

7. A method of cutting a PCB module, the PCB module having a plurality of laser cutting areas and a plurality of through holes, the method comprising:

providing a transparent coverlay film with a plurality of openings defined therein, each of the openings corresponding to one of the laser cutting areas;

attaching the coverlay film onto the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting areas are exposed in the corresponding openings;

holding the PCB module using a vacuum suction device without entering of ambient air and applying a laser beam to the exposed laser cutting area of the PCB module to cut the PCB module; and

removing the coverlay film.

8. The method as claimed in claim 7 , wherein the PCB module defines a plurality of positioning marks, a mark-identifying device is used to obtain the position of the positioning marks as a positioning reference in the step of applying a laser beam to the exposed laser cutting area of the PCB module.

9. The method as claimed in claim 8 , wherein the mark-identifying device is a charge couple device camera.

10. A method of cutting a PCB module, the PCB module including a number of PCB units, each of which defines a laser cutting area and a plurality of through holes, with boundary holes being formed along a boundary of each of the PCB units, the method comprising:

providing a coverlay film with a plurality of opening defined therein, the openings each corresponding to a laser cutting area of the PCB module;

attaching the coverlay film onto a surface of the PCB module such that the through holes of the PCB module are covered by the coverlay film and the laser cutting area of each of the PCB units is aligned and exposed in a corresponding opening;

using a laser cutting system to hold the PCB module with a vacuum suction device and to apply a laser beam to the exposed laser cutting areas of the PCB module to cut the PCB module, wherein no ambient air enters the vacuum suction device; and

removing the coverlay film and separating the PCB units from the PCB module.

11. The method as claimed in claim 10 , wherein the coverlay film is transparent, the PCB module defines a plurality of positioning marks, and the laser cutting system uses the positioning marks as a positioning reference in the step of cutting the PCB module.

12. The method as claimed in claim 11 , wherein a mark-identifying device is used to obtain the position of the positioning marks.

13. The method as claimed in claim 12 , wherein the mark-identifying device is a charge couple device camera.

14. The method as claimed in claim 10 , wherein the PCB module defines a plurality of positioning marks, the coverlay film has a plurality of positioning holes defined therein, each positioning hole corresponds to a positioning mark of the PCB module, the positioning marks are exposed to the outside via the positioning holes in the step of attaching the coverlay film onto a surface of the PCB module, and the laser cutting system uses the positioning marks as a positioning reference in the step of cutting the PCB module.

15. The method of cutting PCB module as claimed in claim 14 , wherein a charge couple device camera is used to obtain the position of the positioning marks.