Method of manufacturing a printed circuit board with circuit visible
View Patent ↗A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade.
1. A method for manufacturing a printed circuit board with circuit visible, comprising:
providing a copper-clad laminate, the copper-clad laminate comprising a copper foil layer, a first adhesive layer, and a first dielectric layer, which are stacked in described order, a flow initiation temperature of the first adhesive layer being in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade;
converting the copper foil layer into a wiring layer to obtain a circuit substrate, the wiring layer comprising at least one electrical contact pad;
laminating a cover film on a side of the wiring layer of the circuit substrate, the cover film comprising a second adhesive layer and a second dielectric layer, the second adhesive layer contacting the circuit substrate, the cover film having at least opening spatially corresponding to the electrical contact pad, arranging a first separate layer and a first buffer layer on a side of the cover film, the first separate layer being sandwiched between the cover film and the first buffer layer, arranging a third separate layer and the second buffer layer on the side of the wiring layer, thereby obtaining a stacked structure, a flow initiation temperature of the second adhesive layer being in a range from 85 degrees centigrade to 90 degrees centigrade, a hardening temperature of the second adhesive being smaller than 150 degrees centigrade, and a soft temperature of a material of each of the first buffer layer and the second buffer layer being lower than 80 degrees centigrade, and
laminating the stacked structure, the temperature of the stacked structure being first controlled to make the first buffer layer soft, the first separate layer contacting the inner sidewall of the opening, thus enabling the softened first buffer layer to fill the opening, then the temperature of the lamination being controlled to make the first adhesive layer and the second adhesive layer be solidified, thereby obtaining a printed circuit board with circuit visible.
2. The method of claim 1 , wherein a material of each of the first dielectric layer and the second dielectric layer is polyethylene terephthalate, and a material of each of the first adhesive layer and the second adhesive layer is Epoxy-Acrylate.
3. The method of claim 2 , wherein a material of the first buffer layer and the second buffer layer is high density polyethylene, and a soft temperature of each of the first buffer layer and the second buffer layer is in a range from 75 degrees centigrade to 78 degrees centigrade.
4. The method of claim 3 , wherein each of the first separate layer and the second separate layer is a release film made of polyethylene terephthalate.
5. The method of claim 4 , wherein a thickness of each of the first buffer layer and the second buffer layer is in a range from 180 micrometers to 200 micrometers, and a thickness of each of the first separate layer and the second separate layer is in a range from 20 micrometers to 25 micrometers.
6. The method of claim 4 , wherein the stacked structure further comprises a first support arranged at a side of the first buffer layer further away from the first separate layer, and a first steel plate, a material of the first support layer is polyethylene terephthalate, and a thickness of the first support layer is in a range from 40 micrometers to 60 micrometers.
7. The method of claim 4 , the stacked structure further comprises a second support sandwiched between the third separate layer and the second buffer layer, a third separate layer arranged at a side of the second buffer layer further away from the second support layer, and a second steel plate, a material of the second support layer is polyethylene terephthalate, and a thickness of the second support layer is in a range from 40 micrometers to 60 micrometers.
8. The method of claim 1 , wherein in the lamination, a maximum value of the temperature is lower than 150 degrees centigrade, and a maximum value of the pressure force is 20 Mpa.