Method for manufacturing a printed circuit board with high-capacity copper circuit

1. A method for manufacturing a printed board with high-capacity copper circuit comprising:

providing a single side cladding copper substrate, and the single side cladding copper substrate comprising a supporting sheet and a base copper foil on the supporting sheet;

forming a first conductive trace pattern on a surface a surface of the base copper foil;

forming a first protecting layer on the first conductive trace pattern, and the first protecting layer being filled in first gaps between the first conductive trace pattern;

removing the supporting sheet;

forming a second conductive trace pattern on another surfaces of the base copper foil, the second conductive trace pattern and the base copper foil together form a plurality of second gaps;

etching the base copper foil exposed by the second gaps to form a base conductive trace pattern, the base conductive trace pattern comprising a plurality of third gaps; and

laminating a second protecting layer on the second conductive trace pattern, the second protecting layer being filled in the plurality of second gaps and the plurality of third gaps.

2. The method of claim 1 , wherein a method of providing the single side copper cladding substrate comprising:

providing a roll of base copper foil;

rolling out the base copper foil from the roll, the base copper foil comprising a first surface and a second surface opposite to the first surface;

adhering a supporting sheet to the second surface;

cutting the base copper foil adhered to the supporting sheet to a required size, thereby forming a plurality of pieces of the single side cover copper sheet.

3. The method of claim 2 , wherein a method for forming the first conductive trace pattern comprising the steps of:

a photosensitive film is adhered to the first surface;

exposing and developing the photosensitive film to form a shielding layer on the first surface, the shielding layer comprises a plurality of openings, the openings exposes the base copper foil;

electroplating a copper layer on the openings;

removing the shielding layer from the first surface, thereby forming the first conductive trace pattern on the surface of the base copper foil.

4. The method of claim 3 , wherein a shape of the first conductive trace is the same as a shape of the second conductive trace pattern.

5. The method of claim 4 , wherein a line width of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.

6. The method of claim 4 , wherein a thickness of the first conductive trace pattern is the same as a thickness of the second conductive trace pattern.

7. The method of claim 6 , wherein a line width of the base copper conductive trace pattern is the same as a line width of the second conductive trace pattern.

8. The method of claim 2 , wherein the supporting sheet is select from the group consisting of polyethylene glycol terephthalate, poly naphthalene dicarboxylic acid glycol ester, or polyimide.

9. The method of claim 1 , wherein after the step of removing the supporting sheet from the base copper foil and before the step of forming a second conductive trace pattern on the other surfaces of the base copper foil, further comprises a step of gridding the second surface of the base copper foil to reduce a thickness of the base copper foil.

10. The method of claim 1 , wherein the first protecting layer and the second protecting layer are select from pre-pregnant and solder mask.