Method for manufacturing rigid-flexible printed circuit board
View Patent ↗A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.
1. A method for manufacturing a rigid-flexible printed circuit board, comprising:
providing a flexible substrate, the flexible substrate including a main portion and a peripheral margin portion, the main portion including a first laminating section and an exposed section;
defining at least one slit in the flexible substrate along at least one first imaginary boundary line between the exposed section and the peripheral margin portion;
providing a rigid substrate, the rigid substrate comprising a main portion and a peripheral margin portion, the main portion including a second laminating section having a similar shape to the first laminating section and an unwanted section having a similar shape to the exposed section;
laminating the flexible substrate to the rigid substrate to obtain a laminated substrate in such a matter that the first laminating section is attached to the second laminating section to form a first section, the exposed section is attached to the unwanted section to form a second section, and the peripheral margin portions are attached with each other to form a third section, wherein the at least one slit is defined in the flexible substrate prior to the step of laminating the flexible substrate to the rigid substrate;
removing the unwanted section to expose the exposed section; and
cutting the laminated substrate along an imaginary boundary line between the first section and the third section to remove the third section.
2. The method as claimed in claim 1 , wherein the unwanted section is removed after the step of laminating the flexible substrate to the rigid substrate.
3. The method as claimed in claim 1 , wherein the laminated substrate is cut after the step of removing the unwanted section.
4. The method as claimed in claim 1 , wherein the at least one slit is formed in the flexible substrate using a laser beam.
5. The method as claimed in claim 1 , wherein the laminated substrate is cut using a milling cutter.
6. The method as claimed in claim 1 , wherein the at least one slit is formed in the flexible substrate using a blanking die.
7. The method as claimed in claim 2 , wherein the laminated substrate is cut after the step of removing the unwanted section.
8. The method as claimed in claim 1 , wherein in the step of laminating the flexible substrate to the rigid substrate, the first laminating section coincides with the second laminating section, and the exposed section coincides with the unwanted section.