Flexible circuit board and method for manufacturing same
View Patent ↗A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.
1. A flexible circuit board comprising:
a first base layer;
a circuit layer coupled to a side of the first base layer and comprising a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines;
a second base layer; and
a bonding layer coupling the second base layer to the circuit layer and defining a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer;
wherein the first opening of the bonding layer and the hollow areas of the circuit layer collectively define an air medium layer surrounding the linear signal line.
2. The flexible circuit board of claim 1 , wherein the first opening has a width larger than a total width of the linear signal line and the hollow areas of the circuit layer.
3. The flexible circuit board of claim 1 , wherein the circuit layer further comprises two connecting parts configured to be coupled to external electronic components.
4. The flexible circuit board of claim 3 , wherein the linear signal line and the grounding lines are located between the two connecting parts.
5. The flexible circuit board of claim 3 , wherein the bonding layer defines two second openings corresponding to the two connecting parts, respectively, the two connecting parts being exposed via the two second opening.
6. The flexible circuit board of claim 5 , wherein the second base layer defines two through windows corresponding to the two second openings and the two connecting parts, the two connecting parts being exposed via the two second opening and the two through windows.
7. The flexible circuit board of claim 6 , further comprising an outer copper foil coupled to the second base layer, wherein the two through windows extend through the outer copper foil.
8. The flexible circuit board of claim 7 , wherein the outer copper foil comprises a grid area corresponding to the linear signal line and the hollow areas.
9. The flexible circuit board of claim 7 , further comprising an additional outer copper foil coupled to the first base layer, wherein the first base layer, the circuit layer, the bonding layer and the second base layer are located between the outer copper foil and the additional outer copper foil.
10. The flexible circuit board of claim 9 , wherein the additional outer copper foil comprises a grid area corresponding to the linear signal line and the hollow areas.
11. The flexible circuit board of claim 9 , further comprising a plurality of conductive holes electrically coupling the outer copper foil, the additional outer copper foil and the grounding lines.
12. The flexible circuit board of claim 9 , further comprising two solder resist layers coupled to the outer copper foil and the additional outer copper foil, respectively, wherein the additional outer copper foil, the first base layer, the circuit layer, the bonding layer, the second base layer and the outer copper foil are located between the two solder resist layers.
13. The flexible circuit board of claim 1 , wherein the two grounding lines of the circuit layer are parallel to each other.
14. A method for manufacturing a flexible circuit board, comprising: providing a first copper clad laminate comprising a first base layer, a copper foil and a first outer copper foil located at two opposite sides of the first base layer; forming a circuit layer from the copper foil to comprise a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines; providing a bonding layer with a first opening; the first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer; providing a second copper clad laminate comprising a second base layer and a second outer copper foil coupled to a side of the second base layer; and laminating the bonding layer and the second copper clad laminate on the circuit layer; wherein the first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line.
15. The method of claim 14 , wherein the circuit layer is formed by etching or electroplating.
16. The method of claim 14 , wherein the circuit layer further comprises two connecting parts configured to be coupled to external electronic components, the bonding layer further defining two second openings corresponding to the two connecting parts, respectively, the two connecting parts being exposed via the two second openings.
17. The method of claim 16 , wherein the second copper clad laminate defines two through windows corresponding to the two second openings and the two connecting parts, the two connecting parts being exposed via the two second openings and the two through windows.
18. The method of claim 14 , further comprising: forming a plurality of conductive holes in the first copper clad laminate, the bonding layer and the second copper clad laminate to electrically connect the first outer copper foil, the second outer copper foil and the grounding lines of the circuit layer.
19. The method of claim 14 , further comprising: forming a first grid area in the first outer copper foil and/or a second grid area in the second outer copper foil corresponding to the linear signal line and the hollow areas of the circuit layer.
20. The method of claim 14 , further comprising: forming two solder resist layers covering the first outer copper foil and the second outer copper foil.