Method for manufacturing a printed circuit board
View Patent ↗An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.
1. A method for manufacturing a printed circuit board, comprising:
providing a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface;
forming a plurality of through holes in the substrate between the first surface and the second surface;
applying an electrically conductive paste to the substrate to cause a first portion of the electrically conductive paste to fill the through holes in the substrate to form a plurality of filling members and simultaneously cause a second portion of the electrically conductive paste to be printed on at least one of the first surface and the second surface of the substrate to form a plurality of electrical traces, thereby the filling members and the electrical traces being formed simultaneously; and
curing the electrically conductive paste in the through holes and the electrically conductive paste printed on the at least one of the first surface and the second surface of the substrate.
2. The method as claimed in claim 1 , wherein the electrically conductive paste is selected from a group consisting of a copper paste, a silver paste and a carbon paste.
3. The method as claimed in claim 1 , wherein the substrate is a prepreg.
4. The method as claimed in claim 1 , wherein the electrically conductive paste is cured under an ultraviolet radiation.
5. The method as claimed in claim 1 , further comprising:
laminating a laminating substrate on the substrate;
forming a plurality of through holes in the laminating substrate between opposite surfaces thereof;
applying an electrically conductive paste to the laminating substrate to fill the through holes in the laminating substrate to form a plurality of filling members; and
curing the electrically conductive paste in the through holes in the laminating substrate.
6. The method as claimed in claim 5 , further comprising:
laminating a copper foil on a surface of the laminating substrate; and
forming the copper foil into a plurality of electrical traces.
7. The method as claimed in claim 1 , further comprising:
laminating a laminating substrate on the substrate;
forming a plurality of through holes in the laminating substrate between opposite surfaces thereof;
applying an electrically conductive paste to the laminating substrate to cause a first portion of the electrically conductive paste to fill the through holes in the laminating substrate to form a plurality of filling members and simultaneously cause a second portion of the electrically conductive paste to be printed on a surface of the laminating substrate to form a plurality of electrical traces, thereby the filling members and the electrical traces being formed simultaneously; and
curing the electrically conductive paste in the through holes in the laminating substrate and the electrically conductive paste on the surface of the laminating substrate.
8. A method for manufacturing a printed circuit board, comprising:
providing a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface;
defining a plurality of through holes in the substrate between the first surface and the second surface;
applying an electrically conductive paste to the substrate using a screen printing process such that a first portion of the electrically conductive paste is printed on at least one of the first surface and the second surface of the substrate for forming into a plurality of electrical traces, and a second portion of the electrically conductive paste is simultaneously received in the through holes in the substrate for forming into filling members in the through holes, thereby the filling members and the electrical traces being formed simultaneously; and
solidifying the electrically conductive paste such that the first portion thereof is formed into the electrical traces on at least one of the first surface and the second surface of the substrate, and the second portion thereof is formed into the filling members in the through holes for establishing electrical connection between the first and second surfaces of the substrate.
9. The method as claimed in claim 8 , further comprising:
laminating a laminating substrate on the substrate;
forming a plurality of through holes in the laminating substrate between opposite surfaces thereof;
applying an electrically conductive paste to the laminating substrate to cause a first portion of the electrically conductive paste to fill the through holes in the laminating substrate to form a plurality of filling members and simultaneously cause a second portion of the electrically conductive paste to be printed on a surface of the laminating substrate to form a plurality of electrical traces, thereby the filling members and the electrical traces being formed simultaneously; and
curing the electrically conductive paste in the through holes in the laminating substrate and the electrically conductive paste on the surface of the laminating substrate.