Flexible circuit board and method for making the same
View Patent ↗A flexible circuit board includes a wiring layer, two photosensitive resin layers, and two electromagnetic interference shielding layers. The wiring layer includes at least one signal line, two ground lines and at least two gaps. Each gap includes two opening portions. The two photosensitive resin layers cover the signal line and the opening portions, and are connected to each end of each ground line. Each electromagnetic interference shielding layer covers one photosensitive resin layer away from the signal line, portions of the two ground lines not connected to the photosensitive resin layer, and portions of the gaps not covered by the two photosensitive resin layers, thereby causing the portions of each gap not covered by the two photosensitive resin layers to define a receiving chamber. Each end of each receiving chamber communicates with one opening portion of the corresponding gap to define a cavity.
1. A flexible circuit board comprising:
a wiring layer comprising at least one signal line, two ground lines positioned at two sides of the at least one signal line, and at least two gaps for separating the at least one signal line and the ground lines from each other, each gap comprising two opening portions each located at positions corresponding to one end of the adjacent signal line;
two photosensitive resin layers; and
two electromagnetic interference shielding layers;
wherein the two photosensitive resin layers cover two opposite surfaces of the at least one signal line and the opening portions, and are connected to each end of each ground line, each electromagnetic interference shielding layer covers a surface of one photosensitive resin layer away from the signal line, portions of the two ground lines not connected to the photosensitive resin layer, and portions of the gaps not covered by the two photosensitive resin layers, thereby causing the two electromagnetic interference shielding layers, the two photosensitive resin layers, the signal line, and the ground lines to surround the portions of each gap not covered by the two photosensitive resin layers and cooperatively define a receiving chamber, each end of each receiving chamber is in air communication with one opening portion of the corresponding gap to define a cavity with air.
2. The flexible circuit board of the claim 1 , wherein the two photosensitive resin layers 30 cover an entire end of each ground line.
3. The flexible circuit board of the claim 1 , wherein the two photosensitive resin layers cover a portion of the end of each ground line.
4. The flexible circuit board of the claim 1 , wherein each electromagnetic interference shielding layer comprises an anisotropic conductive resin layer, a metal layer, and a protective layer; each anisotropic conductive resin layer is connected to one of the two photosensitive resin layers and the two ground lines; the metal layer is formed on a surface of the anisotropic conductive resin layers away from the wiring layer, the protective layer is formed on a surface of the metal layer away from the anisotropic conductive resin layers.