Heat dissipation device and method for manufacturing same
View Patent ↗A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.
1. A method for manufacturing the heat dissipation device, the method comprising:
providing a first copper sheet and a second copper sheet, the first copper sheet comprises a first surface and a third surface opposite to the first surface;
processing the first surface of the first copper sheet to form a plurality of first recesses and a plurality of first cavities in the first surface of the first copper sheet, processing the third surface of the first copper sheet to form a plurality of micro-fins in the third surface of the first copper sheet a height of the microfins in the range of 3 um to 8 um, the first cavities being surrounded by the first recesses, processing the second copper sheet to form a plurality of second recesses and a plurality of second cavities in the second copper sheet, each second recess corresponding to each first recess, each second cavity corresponding to each first cavity;
providing an adhesive on each second recess of the second copper sheet;
providing a working fluid in each second cavity of the second copper sheet;
pressing the first copper sheet on the second copper sheet, and the second copper sheet is fixed with the first copper sheet by the adhesive, each of the first cavities being in communication with a second cavity, each first cavity and each second cavity together forming an airtight receiving cavity;
solidifying the adhesive.
2. The method of claim 1 , wherein a depth of each first recess is much smaller than a depth of the first cavity, a depth of each second recess is much smaller than a depth of the second cavity.
3. The method of claim 1 , wherein the adhesive is low temperature solder paste.
4. The method of claim 1 , wherein the adhesive comprises of molten resin material doped with metal particles, the metal particle is selected from the group comprising copper, silver, tin, bismuth and any combination thereof.
5. The method of claim 4 , wherein a weight ratio of tin in the adhesive is in the range from 89.1 wt % to 89.7 wt %, and a weight ratio of molten resin in the adhesive is in the range from 10.3 wt % to 10.9 wt %.
6. The method of claim 1 , wherein the cross section of the micro-fins is substantially trapezoidal.
7. The method of claim 6 , wherein and a width of the trapezoid is in a range from about 30 um to 40 um.
8. The method of claim 1 , wherein the first copper sheet includes a plurality of ribs between each first cavity, the micro-fins are formed at a location of the third surface which corresponds to the ribs.
9. The method of claim 1 , wherein the first cavities, the second cavities, and the micro-fins are processed using a chemical etching solution or a laser ablation.
10. The method of claim 1 , wherein the adhesive is infilled in the second recess by a screen printing process.