Printed circuit board and method for manufacturing same
View Patent ↗A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
1. A printed circuit board comprising:
an insulating substrate having a surface;
a first circuit layer having a plurality of electrical traces formed on and contacting the surface, the first circuit layer consisting essentially of a composite of carbon nano-tubes and metallic nano-particles; and
an electrically conductive metal layer formed on the first circuit layer for filling clearances between adjacent composite particles of the composite, thereby electrically connecting adjacent composite particles in the circuit layer.
2. The printed circuit board as claimed in claim 1 , wherein the composite of carbon nano-tubes and metallic nano-particles comprises a plurality of composite particles.
3. The printed circuit board as claimed in claim 2 , wherein each of the composite particles comprises at least one carbon nano-tube, and a plurality of metallic nano-particles formed on an external sidewall of the at least one carbon nano-tube.
4. The printed circuit board as claimed in claim 3 , wherein the at least one carbon nano-tube is one of a single-walled carbon nano-tube and a multi-walled carbon nano-tube.
5. The printed circuit board as claimed in claim 2 , wherein each of the composite particles comprises at least one aggregate of carbon nano-tubes, and a plurality of metallic nano-particles formed on an external sidewall of the at least one aggregate of carbon nano-tubes.
6. The printed circuit board as claimed in claim 5 , wherein the at least one aggregate of carbon nano-tubes is comprised of two or more single-walled carbon nano-tubes, two or more multi-walled carbon nano-tubes, or a combination thereof.
7. The printed circuit board as claimed in claim 2 , wherein the electrically conductive metal layer is filled between spaced composite particles.
8. The printed circuit board as claimed in claim 3 , wherein a length of the carbon nano-tube contained in the composite particle is in a range from about 1 nanometer to about 500 nanometers.
9. The printed circuit board as claimed in claim 3 , wherein a diameter of each of the metallic nano-particles is in a range from about 1 nanometer to about 500 nanometers.
10. The printed circuit board as claimed in claim 3 , wherein the metallic nano-particles are comprised of gold, silver, platinum or palladium.
11. The printed circuit board as claimed in claim 5 , wherein a diameter of each of the aggregates of carbon nano-tubes contained in the composite particle is less than 1 micrometer.
12. The printed circuit board as claimed in claim 1 , wherein a width of the first circuit layer is in a range from about 5 micrometers to about 200 micrometers.
13. The printed circuit board as claimed in claim 1 , wherein a width of the first circuit layer is in a range from about 5 micrometers to about 20 micrometers.
14. A printed circuit board comprising:
an insulating substrate having a surface; and
a circuit layer comprising a base layer formed on and contacting the surface and an electrically conductive metal layer formed on the base layer, the base layer consisting essentially of a plurality of carbon nano-tubes, and a plurality of metallic nano-particles, the metallic nano-particles formed on external sidewalls of the carbon nano-tubes.