Patent Assignment
Reel/Frame 040985/0889
Assignment of Assignor's Interest
Recorded: 2017-01-17
Pages: 4
Assignors
YU, KAI-HUNG
Executed: 2017-01-16
TAPILY, KANDABARA N.
Executed: 2017-01-16
CLARK, ROBERT D.
Executed: 2017-01-16
LEUSINK, GERRIT J.
Executed: 2017-01-16
Assignee
TOKYO ELECTRON LIMITED
AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Selective Bottom-Up Metal Feature Filling for Interconnects