Patent Assignment
Reel/Frame 041008/0402
Assignment of Assignor's Interest
Recorded: 2017-01-18
Pages: 7
Assignors
KANG, PIL-KYU
Executed: 2017-01-18
LEE, HO-JIN
Executed: 2017-01-18
PARK, BYUNG-LYUL
Executed: 2017-01-18
KIM, TAE-YEONG
Executed: 2017-01-18
KIM, SEOK-HO
Executed: 2017-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Stacked Device Having Tsv Structure