Patent Assignment
Reel/Frame 041010/0516
Assignment of Assignor's Interest
Recorded: 2017-01-18
Pages: 4
Assignors
HO, YEN-SHIH
Executed: 2017-01-13
LIU, TSANG-YU
Executed: 2017-01-13
LIN, CHIA-SHENG
Executed: 2017-01-13
LAI, CHAUNG-LIN
Executed: 2017-01-13
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same