Patent Assignment
Reel/Frame 041013/0540
Assignment of Assignor's Interest
Recorded: 2017-01-19
Pages: 8
Assignee
J-DEVICES CORPORATION
1913-2 FUKURA, USUKI-CITY, OITA, 8750053, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Package and Semiconductor Package
Application:
15/409,631 →
Publication:
US 2017/0256453
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Aug 25, 2020
From: J-DEVICES CO., LTD.
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053597/0184 →
Corrective Assignment to Correct the Conveying Party Name Previously Recorded at Reel: 53597 Frame: 184. Assignor(S) Hereby Confirms the Assignment.
Mar 5, 2021
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 055605/0060 →