Patent Assignment
Reel/Frame 041021/0935
Assignment of Assignor's Interest
Recorded: 2017-01-20
Pages: 6
Assignors
NISHIKAWA, KAZUYOSHI
Executed: 2017-01-06
SUMIYA, AKIO
Executed: 2017-01-06
HIRONO, SATOSHI
Executed: 2017-01-05
HAKATA, TOMOYUKI
Executed: 2017-01-10
Assignee
OMRON CORPORATION
801, MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU, SHIOKOJI-DORI, SHIMOGYO-KU, KYOTO-SHI,, KYOTO, 600-8530, JAPAN
Covered Property
(1)
Manufacturing Method of Bonding Structure and Bonding Structure