Patent Assignment
Reel/Frame 041025/0319
Assignment of Assignor's Interest
Recorded: 2017-01-20
Pages: 2
Assignor
CHEN, SHIH-HAO
Executed: 2017-01-04
Assignee
VIA TECHNOLOGIES, INC.
8F, 533, ZHONGZHENG RD., XINDIAN DIST., NEW TAIPEI CITY, 231, TAIWAN
Covered Property
(1)
Interface Chip and Test Method Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.