Patent Assignment
Reel/Frame 051075/0258
Assignment of Assignor's Interest
Recorded: 2019-11-21
Pages: 4
Assignor
VIA TECHNOLOGIES, INC.
Executed: 2019-10-22
Assignee
VIA LABS, INC.
7F, 529-1, ZHONGZHENG RD., XINDIAN DIST., NEW TAIPEI CITY, 231, TAIWAN
Covered Properties
(28)
Usb Port for Employing a Plurality of Selectable Data Transmission Priority Rules
High Speed Serial Link Systems
Clock Generator and Usb Module
Serial Bus Device and Clock Difference Compensation Method Thereof
Usb Hub for Supplying Power Upon Determination Whether a Usb Device Is Chargeable According to Data Transfer Rate of the Usb Device
A Bridge Capable of Power Saving by Receiving a Signal Transmitted from a Host Through a Power Pin of a Connector
Active Optical Cable with an Additional Power Connector, and Electronic Device Using the Same
Electrostatic Discharge Protection Device
Rechargeable Battery Module and Battery Charging Method
Discharge Curve Calibration System and Calibration Method for Initial Discharging Curve of Battery
Bridge Device
Method for Reducing Power Consumption in Electronic Apparatus
Semiconductor Device Having Inductor
Intermediate Electronic Device, Method for Operating the Intermediate Electronic Device and Electronic System
Interface Controller, External Electronic Device, and External Electronic Device Control Method
Optical Transmission Device and Optical Transceiver Module
Mechanism for Charging Portable Device with Usb Dock
Electrostatic Discharge Protection Device
Semiconductor Device Having Inductor
Interface Chip and Control Method Therefor
Patent:
9,350,407 →
Application:
14/837,412 →
Control Chip and Control System Utilizing the Same
Integrated Circuit Device
Integrated Circuit Device
Usb Chipset
Interface Chip and Test Method Therefor
Semiconductor Device Having Inductor
Semiconductor Device Having Inductor
Usb Chipset
Related Assignments
(17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 24, 2009
From: LIU, MENG-FANG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 023004/0286 →
Assignment of Assignor's Interest
Aug 31, 2009
From: YANG, SHUN-CHENG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 023169/0008 →
Assignment of Assignor's Interest
May 10, 2010
From: CHEN, SHIH-HAU
To: VIA TECHNOLOGIES, INC.
Reel/Frame 024359/0214 →
Assignment of Assignor's Interest
May 10, 2010
From: TSENG, WEN-YU; LIN, HSIAO-CHYI
To: VIA TECHNOLOGIES, INC.
Reel/Frame 024359/0083 →
Assignment of Assignor's Interest
Jan 20, 2012
From: SHIH, TERRANCE; HSU, CHIN-SUNG; LIN, CHUN-HENG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 027569/0310 →
Assignment of Assignor's Interest
May 16, 2012
From: LIN, HUI-CHIH; CHEN, WEI-HUNG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 028219/0037 →
Assignment of Assignor's Interest
Aug 17, 2012
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 028806/0524 →
Assignment of Assignor's Interest
Nov 1, 2012
From: CHEN, KE-YUAN; LIN, JYH-FONG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 029227/0067 →
Assignment of Assignor's Interest
Jan 18, 2013
From: YEN, SHENG-HSIEN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 029656/0591 →
Assignment of Assignor's Interest
Jan 18, 2013
From: YEN, SHENG-HSIEN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 029656/0843 →
Assignment of Assignor's Interest
Jul 12, 2013
From: TSENG, WEN-YU; LIN, HSIAO-CHYI
To: VIA TECHNOLOGIES, INC.
Reel/Frame 030789/0173 →
Assignment of Assignor's Interest
Oct 18, 2013
From: HUANG, CHENG-MING
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031433/0680 →
Assignment of Assignor's Interest
Nov 11, 2013
From: LEE, SHENG-YUAN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 031575/0331 →
Assignment of Assignor's Interest
Mar 12, 2014
From: CHEN, YI-TE
To: VIA TECHNOLOGIES, INC.
Reel/Frame 032414/0027 →
Assignment of Assignor's Interest
Aug 6, 2014
From: KUO, CHIA-YING; LAI, YI-LIN
To: VIA TECHNOLOGIES, INC.
Reel/Frame 033475/0573 →
Assignment of Assignor's Interest
Jan 8, 2015
From: YING, CHENG-MING; LIN, YU-LUNG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 034664/0114 →
Assignment of Assignor's Interest
Apr 21, 2015
From: HSU, CHIN-SUNG; SHIH, TERRANCE SHIYANG; PAN, LI-FENG
To: VIA TECHNOLOGIES, INC.
Reel/Frame 035459/0914 →