Integrated circuit device
The invention provides an integrated circuit device. The integrated circuit device includes a substrate. A first capacitor is disposed on the substrate. A first metal pattern is coupled to a first electrode of the first capacitor. A second metal pattern is coupled to a first electrode of the second capacitor. A third metal pattern is disposed over the first and second metal patterns. The third metal pattern covers the first capacitor, the first metal pattern, and the second metal pattern. The third metal pattern is electrically grounded. An inductor is disposed over the third metal pattern.
1. An integrated circuit device, comprising:
a substrate;
a first capacitor disposed on the substrate, wherein the first capacitor comprises:
a first well doped region extended from a surface of the substrate to a portion of the substrate;
a first gate structure disposed on the first well doped region; and
a source and a drain respectively positioned on two opposite sides of the first gate structure, wherein the first gate structure serves as the first electrode, the source and the drain serve as the second electrode;
a first metal pattern coupled to a first electrode of the first capacitor;
a second metal pattern coupled to a second electrode of the first capacitor;
a third metal pattern disposed over the first and second metal patterns and covering the first capacitor, the first metal pattern and the second metal pattern, wherein the third metal pattern is coupled to ground; and
an inductor disposed over the third metal pattern.
2. The integrated circuit device as claimed in claim 1 , further comprising:
a plurality of metal layers disposed on the substrate, wherein the third metal pattern and the first metal pattern respectively occupy different metal layers of the metal layers, and wherein the third metal pattern and the second metal pattern respectively occupy different metal layers of the metal layers.
3. The integrated circuit device as claimed in claim 1 , wherein the third metal pattern is disposed directly under the inductor, wherein the first metal pattern and the second metal pattern are disposed directly under the third metal pattern, wherein the first capacitor is disposed directly under the first and second metal patterns, and wherein a boundary of the first metal pattern and a boundary of the second metal pattern are respectively positioned within a boundary of the third metal pattern in a plane view.
4. The integrated circuit device as claimed in claim 1 , wherein the first, second and third metal patterns are separated from and parallel to one another.
5. The integrated circuit device as claimed in claim 1 , wherein the first capacitor is a metal-oxide-semiconductor (MOS) varactor.
6. The integrated circuit device as claimed in claim 1 , wherein the first capacitor is a first metal-oxide-semiconductor (MOS) capacitor.
7. The integrated circuit device as claimed in claim 1 , wherein the first metal pattern and the second metal pattern belong to a first metal layered level, the third metal pattern belongs to a second metal layered level, which is different from the first metal layered level.
8. The integrated circuit device as claimed in claim 1 , wherein the first metal pattern is coupled to a power node of a power net, and the second metal pattern is coupled to ground.
9. The integrated circuit device as claimed in claim 1 , further comprising:
a second capacitor disposed between the substrate and the third metal pattern.
10. The integrated circuit device as claimed in claim 9 , wherein the first capacitor is a first metal-oxide-semiconductor (MOS) capacitor, the second capacitor is a second metal-oxide-semiconductor (MOS) capacitor, which is positioned parallel to the first metal-oxide-semiconductor (MOS) capacitor, wherein a second well doped region of the second metal-oxide-semiconductor (MOS) capacitor is separated from the first well doped region.
11. The integrated circuit device as claimed in claim 9 , wherein the first capacitor is a metal-oxide-semiconductor (MOS) capacitor, the second capacitor is a metal-oxide-metal (MOM) capacitor disposed over the metal-oxide-semiconductor (MOS) capacitor, wherein the second capacitor comprises:
a fourth metal pattern and a fifth metal pattern disposed directly under the third metal pattern; and
an oxide layer disposed among the third metal pattern, the fourth metal pattern and the fifth metal pattern.
12. The integrated circuit device as claimed in claim 11 , wherein the fourth metal pattern is coupled to a power node, and wherein the fifth metal pattern is coupled to ground.
13. The integrated circuit device as claimed in claim 11 , wherein the first metal pattern and the second metal pattern belong to a first metal layered level, the fourth and fifth metal patterns belong to a second metal layered level, and the third metal pattern belongs to a third metal layered level, wherein the first, second and third metal layered levels are different from one another.
14. An integrated circuit device, comprising:
a substrate, wherein a first well doped region and a second well doped region are disposed on the substrate;
a first capacitor disposed on the first well doped region of the substrate;
a second capacitor disposed on the second well doped region of the substrate;
a first metal pattern comprising a first metal trace and a second metal trace, wherein the first and second metal traces are adjacent to each other and coupled to ground; and
an inductor disposed over the first metal pattern,
wherein the first metal trace is arranged between the first well doped region of the substrate and the inductor, and the second metal trace is arranged between the second well doped region of the substrate and the inductor.
15. The integrated circuit device as claimed in claim 14 , wherein the first well doped region and the second doped region are formed by doping an impurity within the substrate.
16. The integrated circuit device as claimed in claim 14 , wherein the first metal trace fully covers the first well doped region, and the second metal trace fully covers the second well doped region in a plane view.
17. The integrated circuit device as claimed in claim 16 , wherein the substrate is exposed to a region positioned between the first and second metal traces.
18. The integrated circuit device as claimed in claim 14 , wherein the first capacitor is a metal-oxide-semiconductor (MOS) varactor.
19. The integrated circuit device as claimed in claim 14 , wherein the first capacitor is a metal-oxide-semiconductor (MOS) capacitor, the metal-oxide-semiconductor (MOS) capacitor comprises:
a gate structure disposed on the first well doped region; and
a source and a drain respectively positioned on two opposite sides of the gate structure, wherein the gate structure serves as the first electrode, the source and the drain serve as the second electrode.
20. The integrated circuit device as claimed in claim 14 , wherein the first capacitor and the second capacitor are connected in parallel.