Patent Assignment
Reel/Frame 041027/0956
Assignment of Assignor's Interest
Recorded: 2017-01-20
Pages: 2
Assignor
LEE, CHUNG-CHIEH
Executed: 2017-01-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Drying Wafer with Gaseous Fluid