IP Library › Assignment 041041/0673
Patent Assignment
Reel/Frame 041041/0673

Assignment of Assignor's Interest

Recorded: 2017-01-23 Pages: 4
Assignors
DESCLOS, LAURENT
Executed: 2014-01-15
SHAMBLIN, JEFFREY
Executed: 2014-01-15
Assignee
ETHERTRONICS, INC.
5501 OBERLIN DRIVE, STE. 100, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Composite Thermoformed Assembly
Patent: 9,425,501 →
Application: 13/449,283 →
Publication: US 2012/0285611
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Oct 21, 2016
From: ETHERTRONICS, INC.
To: NH EXPANSION CREDIT FUND HOLDINGS LP
Reel/Frame 040464/0245 →
Security Interest Aug 11, 2017
From: ETHERTRONICS, INC.
To: SILICON VALLEY BANK
Reel/Frame 044106/0829 →
Release of Security Interest Jan 31, 2018
From: NH EXPANSION CREDIT FUND HOLDINGS LP
To: ETHERTRONICS, INC.
Reel/Frame 045210/0725 →
Change of Name May 4, 2023
From: AVX ANTENNA, INC.
To: KYOCERA AVX COMPONENTS (SAN DIEGO), INC.
Reel/Frame 063543/0302 →
Change of Name May 5, 2023
From: ETHERTRONICS, INC.
To: AVX ANTENNA, INC.
Reel/Frame 063549/0336 →