Composite thermoformed assembly
View Patent ↗Methods for producing cost effective and reliable antennas and circuits for wireless devices are disclosed. The antennas and circuits are formed by applying a conductive layer to one side of a carrier sheet and attaching a second carrier sheet to encapsulate and protect the conductive layer. The combination of the two carrier sheets and the conductive layer are then formed into one or more three-dimensional antenna structures or circuits in a thermoforming process. This technique enables high volume production of antennas and RF circuits in a fast, reliable, and cost-efficient manner that provides for encapsulation of the conductive layer. The plurality of antennas and circuits formed in this fashion may then be separated by a cutting apparatus to obtain individual devices that are ready for integration into myriad communication devices.
1. A method for manufacturing a plurality of composite thermoformed antennas, comprising:
providing a first electrically non-conductive carrier sheet having a first surface and a second surface opposite of the first surface;
applying at least a first conductive layer on the first surface of the first carrier sheet, the first conductive layer including a plurality of conductive portions, each of the conductive portions forming one of: an antenna radiating element, a parasitic element, or an antenna tuning circuit;
providing a second electrically non-conductive carrier sheet;
combining the second carrier sheet with the first carrier sheet such that the first conductive layer is disposed therebetween, wherein the first carrier sheet, first conductive layer, and second carrier sheet form a multi-layer assembly;
applying heat, vacuum, or a combination thereof to the multi-layer assembly to form a multi-antenna array including a plurality of three-dimensional antennas thereof; and
cutting the multi-antenna array to produce a plurality of three-dimensional antennas.
2. The method of claim 1 , further comprising:
applying a second conductive layer to one of: the second surface of the first carrier sheet, or a surface of the second carrier sheet.
3. The method of claim 2 , further comprising:
providing a third electrically non-conductive carrier sheet; and
combining the third carrier sheet with the first carrier sheet, first conductive layer, second carrier sheet, and second conductive layer such that each of the first and second conductive layers is independently disposed between two of: the first through third carrier sheets.
4. The method of claim 3 , with one of the first through third carrier sheets individually comprising one or more apertures, the method further comprising:
combining the first through third layers such that the layer comprising the one or more apertures is configured as a bottom layer of the multi-layer assembly; and
aligning the one or more apertures of the bottom layer with one of the first and second conductive layers for exposing a contact point thereof through each of the one or more apertures.
5. The method of claim 2 , wherein said first conductive layer includes one or more antenna radiating elements; and wherein at least one of said first and second conductive layers includes one or more parasitic elements.
6. The method of claim 5 , wherein said first and second conductive layers are separated by at least one of the first through third carrier sheets; and wherein said first and second conductive layers are separated by a dielectric material.
7. The method of claim 5 , wherein said one or more antenna radiating elements includes a first antenna radiating element configured with at least a first resonance, and a second antenna radiating element configured with at least a second resonance, wherein the second resonance is distinct from the first resonance, and wherein the resulting three-dimensional antennas comprise multi-band antennas.
8. The method of claim 1 , wherein said first conductive layer includes one or more antenna radiating elements.
9. The method of claim 1 , wherein said applying includes one of:
printing conductive ink or electroplating.