Patent Assignment
Reel/Frame 041045/0001
Assignment of Assignor's Interest
Recorded: 2017-01-23
Pages: 3
Assignors
LIANG, CHIA-MING
Executed: 2017-01-10
CHIU, HUAI-HSIEN
Executed: 2017-01-10
MOR, YI-SHIEN
Executed: 2017-01-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Method of Forming Semiconductor Fin Thereof