Patent Assignment
Reel/Frame 041048/0875
Assignment of Assignor's Interest
Recorded: 2017-01-23
Pages: 6
Assignors
KIM, HYUK
Executed: 2016-11-10
CHUNG, SEUNG-PIL
Executed: 2016-11-11
MIN, JAE-HO
Executed: 2016-11-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chips and Methods of Manufacturing the Same