Patent Assignment
Reel/Frame 041069/0189
Assignment of Assignor's Interest
Recorded: 2017-01-24
Pages: 4
Assignors
CHEN, TIEN-SZU
Executed: 2016-11-28
WANG, SHENG-MING
Executed: 2016-11-28
WANG, I-CHENG
Executed: 2016-11-28
SYU, WUN-JHENG
Executed: 2016-11-28
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same