Patent Assignment
Reel/Frame 041073/0219
Assignment of Assignor's Interest
Recorded: 2017-01-25
Pages: 10
Assignors
LIN, JENG-SHYAN
Executed: 2017-01-19
YAUNG, DUN-NIAN
Executed: 2017-01-19
LIU, JEN-CHENG
Executed: 2017-01-19
HUANG, HSUN-YING
Executed: 2017-01-19
WENG, WEI-CHIH
Executed: 2017-01-19
SHEN, YU-YANG
Executed: 2017-01-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Stacked Substrate Structure with Inter-Tier Interconnection