Patent Assignment
Reel/Frame 041073/0535
Assignment of Assignor's Interest
Recorded: 2017-01-25
Pages: 4
Assignors
CHEN, SHING-CHAO
Executed: 2017-01-10
LIN, CHIH-WEI
Executed: 2017-01-10
LIN, CHING-YAO
Executed: 2017-01-10
CHENG, MING-DA
Executed: 2017-01-10
HSIEH, CHING-HUA
Executed: 2017-01-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method for Forming the Same