Patent Assignment
Reel/Frame 041088/0548
Assignment of Assignor's Interest
Recorded: 2017-01-26
Pages: 7
Assignors
KIM, TAE-YEONG
Executed: 2016-10-21
KANG, PIL-KYU
Executed: 2016-10-20
KIM, SEOK-HO
Executed: 2016-10-20
MOON, KWANG-JIN
Executed: 2016-10-20
LEE, HO-JIN
Executed: 2016-10-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer-To-Wafer Bonding Structure