Patent Assignment
Reel/Frame 041100/0186
Assignment of Assignor's Interest
Recorded: 2017-01-27
Pages: 4
Assignors
ISHIHARA, TERUYUKI
Executed: 2016-11-01
BAN, HIROYUKI
Executed: 2016-11-01
MEI, HAIYING
Executed: 2016-11-01
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing the Same