Patent Assignment
Reel/Frame 041102/0387
Assignment of Assignor's Interest
Recorded: 2017-01-27
Pages: 3
Assignors
TSAI, MIN-YING
Executed: 2017-01-23
WU, CHENG-TA
Executed: 2017-01-23
TU, YEUR-LUEN
Executed: 2017-01-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Deep Trench Structure