Patent Assignment
Reel/Frame 041118/0887
Assignment of Assignor's Interest
Recorded: 2017-01-30
Pages: 5
Assignors
LIN, TZU-HUNG
Executed: 2017-01-24
PENG, I-HSUAN
Executed: 2017-01-24
HSIAO, CHING-WEN
Executed: 2017-01-18
LIU, NAI-WEI
Executed: 2017-01-24
HUANG, WEI-CHE
Executed: 2017-01-24
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Fan-Out Package Structure and Method for Forming the Same